Characterization of a Copper Powder for Heat Pipe Wick Applications

( Vol-5,Issue-10,October 2018 ) OPEN ACCESS

Guilherme Antonio Bartmeyer, Larissa Krambeck, Robson Couto da Silva, Davi Fusão, Thiago Antonini Alves


copper powder, characterization, heat pipe wick.


In powder metallurgy, it is necessary to know the powder’s nature to understand how the processing of a powder occurs. In this paper, a characterization of a copper powder for heat pipe wick applications was experimentally done. The copper powder manufacturing method was atomization. This metallic powder was characterized by Scanning Electron Microscopy (SEM), X-Ray Fluorescence Spectrometry (ED-XRF), and Laser Diffraction Granulometry. As a result, the purity and the shape are compatible with the powder manufacturing method and great for wicks. Also, the copper powder has a unimodal distribution that is excellent for capillary structures.

ijaers doi crossref DOI:


Paper Statistics:
  • Total View : 232
  • Downloads : 38
  • Page No: 052-054
Cite this Article:
Click here to get all Styles of Citation using DOI of the article.

[1] R. M. German, Powder Metallurgy & Particulate Materials Processing. Princeton: Metal Powder Industries Federation, 2005.
[2] R. M. German, Sintering: From Empirical Observa-tions to Scientific Principles, 1st ed. Amsterdam: Butterworth-Heinemann, 2014.
[3] L. F. Pease III and W. G. West, Fundamentals of Powder Metallurgy. Princeton: Metal Powder Industries Federation, 2002.
[4] L. Krambeck, Thermal performance experimental study of copper powder sintered capillary structures in heat pipes, Dissertation (Mechanical Engineering), Federal University of Technology - Paraná, Ponta Grossa, Brazil (in Portuguese).
[5] G. E. Dieter, Mechanical Metallurgy. New York: McGraw-Hill, 1986.
[6] D. A. Reay, P. A. Kew, and R. J. McGlen, Heat Pipe: Theory, Design and Applications. Amsterdam: Butterworth-Heinemann, 2014.
[7] L. Krambeck, G. A. Bartmeyer, D. Fusão, P. H. D. Santos, and T. Antonini Alves, “Experimental research of capillary structures technologies for heat pipes,” Proceedings of the 24th ABCM International Congress of Mechanical Engineering, Curitiba/BRA, 2017.
[8] L. Krambeck, F. B. Nishida, V. M. Aguiar, P. H. D. Santos, and T. Antonini Alves,“Thermal performance evaluation of different passive devices for electronics cooling,” Thermal Science, in press, 2018.